Metal Testing Thickness Gauges

Metal Testing Thickness Gauges

LEADING EDGE ULTRASONIC TESTING INSTRUMENTS FOR
METAL, CONCRETE AND COMPOSITE MATERIAL TESTING

Instruments for thickness measurements pipes and contraction made of different ferrous and nonferrous metals and plastics as well as weld joints inspection, locating corrosion, cracks, delaminations, foreign inclusions and other flaws and there sizing up.

Universal ultrasonic thickness gauge with large high contrast display, integrated extra functions and various modes of measuring, possibility to work with all double-crystal transducers. The thickness gauge can operate at the mode of displaying results as digital data or at the mode with graphic imaging of the signal A-Scan.

A modernized EMA thickness gauge with an innovative electro – magnetic biasing technology implemented in EMA transducers is designed to measure thickness of objects made of steel and aluminum alloys without the use of coupling liquid.

NEW GENERATION THICKNESS GAUGE
THE WORLD’S SMALLEST USER FRIENDLY THICKNESS GAUGE WITH REAL-TIME DATA INTERFACE TO SMARTPHONE
The instrument is an unbeatable tool for fast ultrasonic wall thickness measurements on boilers and vessels, hull plates and other objects made of ferrous and non-ferrous metals, as well as for ultrasonic thickness measurements of the small-diameter metal and plastic pipes.

THE WORLD’S FIRST EMA THICKNESS GAUGE
WITH AN INNOVATIVE ELECTRO-MAGNETIC BIASING TECHNOLOGY IMPLEMENTED IN EMA TRANSDUCERS
Provides high-productivity testing objects made of steel and aluminum without the use of coupling liquid, without strong adhesion of the transducer to the surfaces of the objects that preventing metal chips from sticking to the transducer’s protector, thus extending its service life.

PORTABLE ULTRASONIC FLAW DETECTOR – TOMOGRAPH
WITH DIGITALLY FOCUSED ARRAY AND SAFT DATA PROCESSING
Provides quick, easy and reliable location of flaws in welding joints and metal, plastic objects in real time with visualization of different types of flaws on the screen of the device. 3D imaging of the testing object.

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